Slicing Crystalline Silicon Wafer by Deep Subsurface Laser Processing and Selective Chemical Etching
2019 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC)（2019）
Key words
cupper nitrite-based selective chemical etchant,laser-induced silicon slicing technique,high etch rate,laser-modified regions,laser beam,cross-sectional plane,focal position,raster scan,focal point,structural modifications,silicon subsurface,nanosecond-pulsed fiber laser,LASIS method,deep subsurface laser processing,crystalline silicon wafer,wavelength 1.55 mum,Si
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