Exploring the Limits of Cobalt Liner Thickness in Advanced Copper Interconnects
IEEE Electron Device Letters（2019）
关键词
Resistance,Metallization,Electromigration,Capacitance,Reliability,Electrical resistance measurement,Dielectric breakdown,Copper,interconnects,line resistance
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要