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Development of High Power and High Junction Temperature SiC Based Power Packages

Gongyue Tang,Leong Ching Wai,Teck Guan Lim,Yong Liang Ye,Ravinder Pal Singh,Lin Bu,Boon Long Lau,Tai Chong Chai,Kazunori Yamamoto,Xiaowu Zhang

Electronic Components and Technology Conference（2019）

Cited 4|Views50
Key words
power package,power inverter module,SiC chip,dual-side-cooling, wide band gap semiconductor
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