Advanced TCAD Simulation of Silver Sintering for Power Modules Integration.
2018 12TH INTERNATIONAL CONFERENCE ON ADVANCED SEMICONDUCTOR DEVICES AND MICROSYSTEMS (ASDAM)（2018）
Key words
bonding material,solder,excellent electrical properties,thermal properties,electro-thermal reliability,thermal design,thermal simulation,integral part,advanced TCAD simulation,silver sintering,emerging miniaturization,interface materials,high thermal conductivity,electrical conductivity,low temperature,pressure,power converter,silver-sintering technology,power modules integration,Ag
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