Charge Transport Model to Predict Dielectric Breakdown As a Function of Voltage, Temperature, and ThicknessSean P. Ogden,Yueming Xu,Kong Boon Yeap,Tian Shen,Toh-Ming Lu,Joel L. PlawskyMicroelectronics Reliability（2018）引用 3|浏览58AI 理解论文溯源树样例生成溯源树，研究论文发展脉络Chat Paper正在生成论文摘要
