Microring-Based Si/SiN Dual-Layer Switch Fabric
2018 IEEE Optical Interconnects Conference (OI)（2018）
Key words
thermo-optic device,flip-chip bonding,ultra-compact footprint,switch-and-select architecture,thermally-actuated switch fabric,crosstalk switching applications,Si/SiN dual-layer structure,microring-based Si/SiN dual-layer switch fabric,Si-SiN
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