Test Structures for the Characterisation of Sensor Packaging Technology

E. O. Blair, A. Buchoux,A. Tsiamis,C. Dunare,J. R. K. Marland,J. G. Terry,S. Smith,A. J. Walton

2017 International Conference of Microelectronic Test Structures (ICMTS)（2017）

Cited 4|Views36

Key words

packaging process,biomedical sensor,UV curable resin,chip surface,electrical continuity,permeability,liquid environments,sensor packaging materials,test structures,sensor packaging technology characterisation

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