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20.4 Design and Migration Challenges for an Alpha Microprocessor in a 0.18µm Copper Process

Ray Hokinson,Bradley J Benschneider,M Arneborn,Daniel C Clay,J Clouser,S A Dumford,V Kalathur,V Kalidindi,S Kovvali, Jurgen Krause,S Maresh, W Munger, Norm T Oneill,I Pragaspathy, Wei Qin,Reiko Sasamori,Sami Sayadi,Tarunraj Singh, Jian Tang,M Tracz, S P Watkins

international solid-state circuits conference（2001）

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Key words
land grid array,flip chip,copper
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