On the Retention Time Distribution of Dual-Channel Vertical DRAM Technologies
2003 International Symposium on VLSI Technology, Systems and Applications Proceedings of Technical Papers (IEEE Cat No03TH8672)
关键词
DRAM chips,JFET integrated circuits,leakage currents,asymmetric vertical device design,buried strap outdiffusion,defect levels,dual channel vertical transistor DRAM technology,gated-diode measurements,high junction electric field,junction depletion volume,leakage current,p-well concentration,probe storage,retention time distribution,shallow arsenic bitline junction
AI 理解论文
溯源树
样例

生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要