WeChat Mini Program
Old Version Features

A Heterogeneous 3D-Ic Consisting of Two 28 Nm Fpga Die and 32 Reconfigurable High-Performance Data Converters

Christophe Erdmann,Donnacha Lowney,Adrian Lynam,Aidan Keady,John McGrath,Edward Cullen,Daire Breathnach,Denis Keane,Patrick Lynch,Marites De La Torre,Ronnie De La Torre,Peng Lim,Anthony Collins,Brendan Farley,Liam Madden

IEEE Journal of Solid-State Circuits（2014）

Cited 105|Views1
Key words
2.5D,3D-IC,ADC,analog,CMOS,DAC,data converter,FPGA,heterogeneous,high performance,low power,reconfigurable,SSI
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined