Package-silicon Co-Design - Experiment with an SOC Design.
17th International Conference on VLSI Design Proceedings
关键词
byextensive package simulation,different package layoutparameters,package vialocations,O cell design,areaand signal integrity issue,floorplanning andpackage layout,signal integrity,thepackage layout design,SSNand crosstalk number,core bump location,Package-silicon co-design,SOC design
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