High Density Interconnect Multi-Chip Module for the Front-End Electronics of the Phenix/Mvd

SF Hahn, JP Sullivan,HW van Hecke,JE Simon-Gillo,GD Smith,BR Schlei,A Sun,GR Young,CL Britton,MS Emery,M Bobrek

IEEE Transactions on Nuclear Science（2000）

引用 6|浏览8

关键词

Integrated circuit interconnections,Substrates,Nuclear electronics,Nuclear physics,Silicon,Detectors,Integrated circuit technology,Thin film circuits,Application specific integrated circuits,Assembly

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要