基本信息
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Bio
Zheng Zhang (Associate Member, IEEE) received the Ph.D. degree in engineering from Osaka University, Osaka, Japan, in 2020.
He is currently an Assistant Professor with the Flexible 3D System Integration Laboratory, SANKEN, Osaka University. His research interests mainly include materials, methods, and reliability evaluation for the electronics packaging. His currently research interest includes condition monitoring for power electronics device.
Research Interests
Papers共 73 篇Author StatisticsCo-AuthorSimilar Experts
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Masahiko Nishijima,Ming-Chun Hsieh,Zhang Zheng,Aiji Suetake, Rieko Okumuara, Hiroyoshi Yoshida,Chuantong Chen, Hiroki Seto, Yuhei Kitahara, Kei Hashizume, Kimihiro Yamanaka,Katsuaki Suganuma
2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)pp.11-12, (2025)
Yaxin Wei, Hanao Deng, Jia Chen,Wenyuan Li, Jianan Xu,Salman Riaz,Zheng Zhang,Yahong Xie,Aimin Chang,Bo Zhang
2024 International Conference on Electronics Packaging (ICEP)pp.251-252, (2024)
Yang Liu,Chuantong Chen,Ye Wang,Zheng Zhang, Ran Liu,Minoru Ueshima, Ichiro Ota,Hiroshi Nishikawa,Masahiko Nishijima, Koji S. Nakayama,Katsuaki Suganuma
Composites Part B Engineering (2024): 111519-111519
MATERIALS CHARACTERIZATION (2024)
2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT (2024)
Materials Science and Engineering A (2024): 146089-146089
2024 International Conference on Electronics Packaging (ICEP)pp.311-312, (2024)
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Author Statistics
#Papers: 73
#Citation: 764
H-Index: 17
G-Index: 26
Sociability: 5
Diversity: 2
Activity: 25
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