Yong Liu

Yong Liu (SM'05) received the B.S. degree in mechtronics (precision electronic-mechanical device), and the M.S. and Ph.D. degrees in mechanical engineering from Nanjing Univeristy of Science and Technology, Nanjing, China, in 1983, 1987, and 1990, respectively. Since 2001, he has been with the Fairchild Semiconductor Corporation, South Portland, ME. He was a Senior Technical Staff Member from 2008, a Technical Staff Member from 2004 to 2007, and a Principal Engineer from 2001 to 2004. He is now an electrical, thermal-mechanical modeling and analysis Team Leader at Fairchild. He has co-authored over 130 papers in journals and conferences, and has filed over 40 U.S. patents in the area of 3-D/Stack/TSV, integrated circuit (IC) packaging, and power devices. His research interests include IC packaging, modeling and simulation, reliability, and material characterization.