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论文共 151 篇作者统计合作学者相似作者

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RF Si Interposer Platform for Chiplets Based Heterogenous Systems
Xiao Sun, Siddhartha Sinha, Martijn Huynen, Reinier Broucke, Melina Lofrano,Vladimir Cherman, Hamideh Jafarpoorchekab, Damien Leech, Angel Uruena,Ehsan Shafahian, Nelson Pinho, Francois Chancerel, Koen Kennes,Sam Lemey,Andy Miller,Eric Beyne,Nadine Collaert
2025 IEEE 75th Electronic Components and Technology Conference (ECTC)pp.189-196, (2025)
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Experimental Thermal Characterization of Thin Film Low-K Dielectric Materials
Herman Oprins,Vladimir Cherman,Bjorn Vermeersch, Federica Luciano,Xinyue Chang,Valeria Founta, Youqi Ding,Christoph Adelmann,Zsolt Tokei
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-8, (2024)
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3D Interconnects for Quantum Computing
Jaber Derakhshandeh,Anish Dangol, Tassawar Hussain,Heiko Stegmann,A. M. Vadiraj, Prathamesh Dhakras,Thomas Witters,Ehsan Shafahian, Kumar M. K. Punith,Carine Gerets,Aleksandar Radisic, Aldrin Vaquilar, Aksel Goehnermeier,Danny Wan,Andy Miller,Anne Jourdain,Vladimir Cherman,Gerald Beyer,Eric Beyne,Kristiaan De Greve
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.821-828, (2024)
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Enhancement of Direct Liquid Jet Impingement Cooling Through Laser-Fabricated Micro Pin-Fins on the Chip-Backside
G. Elsinger,H. Oprins,V. Cherman, G. Van der Plasv,E. Beyne, I. De Wolf
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-10, (2024)
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Temperature and Pressure Dependent Thermal Interface Material Characterization Using Packaged Thermal Test Vehicle Assemblies
Onur Yenigun,Vladimir Cherman,Herman Oprins,Geert Van der Plas,Eric Beyne,Ingrid De Wolf
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-9, (2024)
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Experimentally Validated Thermal Modeling Prediction for BEOL and BSPDN Stacks
Xinyue Chang,Herman Oprins,Bjorn Vermeersch,Vladimir Cherman,Melina Lofrano,Seongho Park,Zsolt Tokei,Ingrid De Wolf
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.498-505, (2024)
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Block Level and Package Level Thermal Assessment for Back Side Power Delivery Network
Melina Lofrano,Herman Oprins,Vladimir Cherman, Lisbeth Witters,Anne Jourdain,Geert Van der Plas,Eric Beyne
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.1036-1043, (2024)
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作者统计

#Papers: 150

#Citation: 2197

H-Index: 25

G-Index: 40

Sociability: 6

Diversity: 3

Activity: 3

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