Sten Vollebregt

基本信息

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职业迁徙

个人简介

Expertise: Graphene, carbon nanotubes, sensors, nanoparticles, wide bandgap semiconductors His research focuses on the integration of emerging electronic materials into semiconductor technology for sensing applications. His research interests are (carbon-based) nanomaterials, 3D monolithic integration, wide-bandgap semiconductors, and (harsh) environmental sensors.

研究兴趣

论文共 164 篇作者统计合作学者相似作者

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Beyond Conventional Characterization: Defect Engineering Role for Sensitivity and Selectivity of Room-Temperature Uv-Assisted Graphene-Based No₂ Sensors

Alvaro Pena,Jesus Lopez-Sanchez,Leandro Sacco,Sten Vollebregt, Jorge Marques-Marchan,M. Carmen Horrillo, Pilar Marin,Daniel Matatagui

TALANTA (2025)

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Transfer-Free Integration of Graphene on Suspended Micro-Hotplates for No2 Sensing

Leandro N. Sacco,Sten Vollebregt

2025 IEEE 38th International Conference on Micro Electro Mechanical Systems (MEMS)pp.904-907, (2025)

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Vibrational Modes As the Origin of Dielectric Loss at 0.27-100 THz in A-Sic:H

B. T. Buijtendorp,A. Endo,W. Jellema,K. Karatsu,K. Kouwenhoven, D. Lamers, A. J. van der Linden,K. Rostem, H. M. Veen,E. J. Wollack,J. J. A. Baselmans,S. Vollebregt

PHYSICAL REVIEW APPLIEDno. 1 (2025)

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A Fully Integrated Sequential Synchronized Switch Harvesting on Capacitors Rectifier Based on Split-Electrode for Piezoelectric Energy Harvesting

Xinling Yue,Jiarui Mo,Zhiyuan Chen,Sten Vollebregt,Guoqi Zhang,Sijun Du

IEEE TRANSACTIONS ON POWER ELECTRONICSno. 6 (2024): 7643-7653

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Vibrational Modes As the Origin of Dielectric Loss at 0.27x2013100 THz in A-Sic:H

B. T. Buijtendorp,A. Endo,W. Jellema,K. Karatsu,K. Kouwenhoven, D. Lamers, A. J. van der Linden,K. Rostem, M. Veen,E. J. Wollack,J. J. A. Baselmans,S. Vollebregt

arxiv（2024）

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Temperature Dependent Trap Characterisation and Modelling of Silicon Carbide MOS Capacitor

Jinglin Li,Sten Vollebregt,Yaqian Zhang,Aditya Shekhar,Alexander May,Willem D. Van Driel,Guoqi Zhang

2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-6, (2024)

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In Situ Analysis of Copper Microstructures in Electromigration Using SEM-EBSD Techniques

Yaqian Zhang, Yixin Yan,Sten Vollebregt,Guoqi Zhang

PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.1317-1321, (2024)

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An Analog to Digital Converter in a SiC CMOS Technology for High-Temperature Applications