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论文共 48 篇作者统计合作学者相似作者

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Q-factor Improvement of Surface Ion Trap Fabrication
H. Y. Li, Morteza Ahmadi, Huihong Clarence Liu,Norhanani Jaafar, Mishra Dileep,Simon Chun Kiat Goh, YanYan Zhou,Manas Mukherjee
QUANTUM COMPUTING, COMMUNICATION, AND SIMULATION IV (2024)
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Design and Fabrication of 2.5D Cryogenic Interposer with Integrated Superconducting TSVs and Resonators
HongYu Li,King-Jien Chui,Simon Chun Kiat Goh,Rangga Perdana Budoyo,Nguyen Hoang Long,Yong Chyn Ng, Daniel Lau, B. N. Jaafar,Yuanzheng Paul Tan,Rainer Dumke
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.458-463, (2024)
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Electrical Characterization and Reliability Studies of Nano-TSV
Ya-Ching Tseng,King-Jien Chui,Simon Chun Kiat Goh, Daniel Lau,Hongyu Li,Tran Van Nhat Anh,Haitao Yu,Chin Khang Tew,Gim Guan Chen,Binni Varghese,Calvin Chua Hung Ming
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.1581-1586, (2024)
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Room Temperature Plasma-Enhanced Niobium-Niobium Wafer Bonding for 3D Integration of Superconducting Interconnects for Quantum Processing
Simon Chun Kiat Goh,Cheemalamarri Hemanth Kumar,Liangxing Hu, Woon Shervonne,Norhanani Jaafar, Yap Lee Khoon Sherry,Ding Huang,Chit Siong Lau, Senthil Kumar Karuppannan, Hongyu Li,Chuan Seng Tan,King-Jien Chui
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.404-408, (2023)
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Multi-Axial Elastic Averaging for Sub-Micron Passive Alignment of Photonic Components
Simon Chun Kiat Goh,Chun Fei Siah,Baochang Xu,Yu Zhang,Mei Er Pam, Enrico Guevarra, Edwin Sze Ping Goh, Lin Wang, Brian Pile, Arbiz Carlan, James Yong Meng Lee,Suresh Venkatesan,Yeow Kheng Lim,Aaron Voon-Yew Thean
JOURNAL OF LIGHTWAVE TECHNOLOGYno. 12 (2023): 3986-3992
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作者统计

#Papers: 48

#Citation: 515

H-Index: 9

G-Index: 22

Sociability: 5

Diversity: 3

Activity: 8

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