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Bio
Séverine Chéramy (Member, IEEE) received the Engineering degree from Polytech Orleans, Orleans, France, in 1998, having specialized in material science.
She has spent over eight years at GEMALTO, Aix en Provence, France, a leading smart-card company developing technologies for secure solutions, such as contactless smart cards and electronic passports. In 2008, she joined CEA-Leti, Grenoble, France, as a 3D Project Leader and then as a 3D Integration Laboratory Manager. This group develops technology and integration for 3DIC, in strong relationship with 3D design, model, and simulation teams. Since January 2017, she has been responsible for 3DIC integration strategy and related business development. She is also the Director of the 3D project of the Institute of Technological Research (ITR) Nanoelec.
Research Interests
Papers共 38 篇Author StatisticsCo-AuthorSimilar Experts
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IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.470-475, (2021)
2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) (2021)
Pascal Vivet,Eric Guthmuller,Yvain Thonnart,Gael Pillonnet,Cesar Fuguet,Ivan Miro-Panades,Guillaume Moritz,Jean Durupt,Christian Bernard,Didier Varreau,Julian Pontes,Sebastien Thuries,David Coriat,Michel Harrand,Denis Dutoit,Didier Lattard,Lucile Arnaud,Jean Charbonnier,Perceval Coudrain,Arnaud Garnier,Frederic Berger,Alain Gueugnot,Alain Greiner,Quentin L. Meunier,Alexis Farcy,Alexandre Arriordaz,Severine Cheramy,Fabien Clermidy
Pascal Vivet,Eric Guthmuller,Yvain Thonnart,Gaël Pillonnet,Guillaume Moritz,Ivan Miro-Panadès,César Fuguet Tortolero,Jean Durupt,Christian Bernard,Didier Varreau,Julian J. H. Pontes,Sebastien Thuries,David Coriat,Michel Harrand,Denis Dutoit,Didier Lattard,Lucile Arnaud,Jean Charbonnier,Perceval Coudrain,Arnaud Garnier,Frederic Berger,Alain Gueugnot,Alain Greiner,Quentin L. Meunier,Alexis Farcy,Alexandre Arriordaz,Séverine Cheramy,Fabien Clermidy
Pascal Vivet,Eric Guthmuller,Yvain Thonnart,Gael Pillonnet,Guillaume Moritz,Ivan Miro-Panades,Cesar Fuguet,Jean Durupt,Christian Bernard,Didier Varreau,Julian Pontes,Sebastien Thuries,David Coriat,Michel Harrand,Denis Dutoit,Didier Lattard,Lucile Arnaud,Jean Charbonnier,Perceval Coudrain,Arnaud Garnier,Frederic Berger,Alain Gueugnot,Alain Greiner,Quentin Meunier,Alexis Farcy,Alexandre Arriordaz,Severine Cheramy,Fabien Clermidy
2020 IEEE INTERNATIONAL SOLID- STATE CIRCUITS CONFERENCE (ISSCC)pp.46-+, (2020)
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IEEE transactions on components, packaging, and manufacturing technologyno. 3 (2019): 434-445
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Author Statistics
#Papers: 38
#Citation: 405
H-Index: 12
G-Index: 19
Sociability: 5
Diversity: 2
Activity: 2
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