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论文共 19 篇作者统计合作学者相似作者

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Indirect Time-of-flight Pixel Study: 3D Monte Carlo Simulation Approach
Bruno H. Lopes,Pascal Fonteneau,Denis Rideau,Remi Helleboid,Gabriel Mugny, Boris R. Goncalves,Matteo M. Vignetti,Goutham Nayak,Maryline Bawedin,Anne Kaminski
PHYSICS AND SIMULATION OF OPTOELECTRONIC DEVICES XXXII (2024)
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Quantum Modeling of Semiconductors Leakage Currents Induced by Defects
A. Jay, C. Mesnard,I. Nicholson,R. Helleboid,G. Mugny,D. Rideau,V. Goiffon,L. Martin Samos,N. Richard,A. Hemeryck
2023 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES, SISPADpp.141-144, (2023)
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Multiscale SPAD Modeling: from Monte Carlo to SPICE Simulations
Denis Rideau,remi HELLEBOID,Gabriel Mugny,Raul-andres BIANCHI, Jean-Robert MANOUVRIER,Isobel NICHOLSON,Jeremy Grebot, Elsa LACOMBE, Alexandre Lopez,D. Golanski,B. Mamdy,Bruce RAE,Sara PELLEGRINI,Megan AGNEW,Wilfried Uhring, SWEN RINK, H. Wehbe Alause
Advanced Photon Counting Techniques XVII (2023)
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Band Structure and Optical Absorption of Strained Si1−x−yGexCy Alloys: a Tight-Binding Approach
D. Rideau, O. Jeannin, A. Arnaud,J. Grebot,I. Nicholson,R. Helleboid,G. Mugny
2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (2023)
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Bayesian Optimization of Light Grating for High Performance Single-Photon Avalanche Diodes
Jeremy Grebot,Remi Helleboid,Gabriel Mugny,Isobel Nicholson, Louis-Henri Fernandez Mouron,Stephane Lanteri,Denis Rideau
2023 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES, SISPADpp.365-368, (2023)
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Full-Band Monte Carlo Study of Hot Carriers for Advection-Diffusion Monte Carlo Simulations
Remi Helleboid,Jerome Saint-Martin,Marco Pala,Philippe Dollfus,Gabriel Mugny,Isobel Nicholson,Denis Rideau
2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (2023)
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Simulation in Action: the Application of Modelling to SPAD Architecture Design
S. Pellegrini,I. Nicholson,R. Helleboid,B. Mamdy, G. Forcolin, M. Al-Rawhani,C. Buj, G. Marchand,B. Rae,D. Golanski,G. Mugny,R. A. Bianchi,D. Rideau
2023 International Electron Devices Meeting (IEDM)pp.1-4, (2023)
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Direct Measurements and Modeling of Avalanche Dynamics and Quenching in SPADs
D. Rideau,W. Uhring,R. A. Bianchi,R. Helleboid,G. Mugny,J. Grebot,J. R. Manouvrier, R. Neri, F. Brun,M. Dolatpoor Lakeh, S. Rink,J-B. Kammerer,C. Lallement,E. Lacombe,D. Golanski,B. Rae, T. M. Bah, F. Twaddle,V. Quenette, G. Marchand,C. Buj, R. Fillon,Y. Henrion,I. Nicholson,M. Agnew, M. Basset, R. Perrier, M. Al-Rawhani,B. Mamdy, S. Pellegrin,G. Gouget, P. Maciazek,A. Juge,A. Dartigues, H. Wehbe Alause
ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC) (2023)
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作者统计

#Papers: 19

#Citation: 41

H-Index: 5

G-Index: 6

Sociability: 4

Diversity: 1

Activity: 3

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