Paul G. Clem

Paul G. Clem is a Principal Member of the Technical Staff in the Microsystem Materials Department at Sandia National Laboratories, where he has worked for the last 11 years on materials development and integration for integrated electronics, MEMS devices, RF devices, direct write materials integration, and superconducting applications. He holds a B.S. degree in Materials Science and Engineering from the University of California at Berkeley, and a Ph.D. degree in Materials Science and Engineering from the University of Illinois at Urbana-Champaign. His primary research area is development of processing routes for integrated metal and electroceramic thin film and thick film devices. Areas of research include direct write (inkjet, aerosol spray, colloidal robocasting) materials printing, microcontact printing, superconductors, ferroelectrics, piezo-electrics, MEMS integration, and radio frequency electronics. He has published over 60 papers, received three US patents, and is an officer of the Electronics Division of the American Ceramic Society, a General Chair of the IEEE Ultrasonics, Ferroelectrics, and Frequency Control Division, and an associate editor of the Journal of the American Ceramic Society. He received the 2007 IEEE UFFC Ferroelectrics Young Investigator Award and has received awards for outstanding research from the Materials Research Society and American Ceramic Society.