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Research Interests

Papers共 90 篇Author StatisticsCo-AuthorSimilar Experts

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Design and Fabrication of 2.5D Cryogenic Interposer with Integrated Superconducting TSVs and Resonators
HongYu Li,King-Jien Chui,Simon Chun Kiat Goh,Rangga Perdana Budoyo,Nguyen Hoang Long,Yong Chyn Ng, Daniel Lau, B. N. Jaafar,Yuanzheng Paul Tan,Rainer Dumke
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.458-463, (2024)
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Electrical Characterization and Reliability Studies of Nano-TSV
Ya-Ching Tseng,King-Jien Chui,Simon Chun Kiat Goh, Daniel Lau,Hongyu Li,Tran Van Nhat Anh,Haitao Yu,Chin Khang Tew,Gim Guan Chen,Binni Varghese,Calvin Chua Hung Ming
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.1581-1586, (2024)
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Damascene Compatible Low Thermal Budget Fine-Pitch Copper Hybrid Boding with Ultra-Thin Surface Passivation
Hemanth Kuamr Cheemalamarri,Gim Guan Chen,Hongyu Li, Chandra Rao Bhesetti,Nagendra Sekhar Vasarla,Nandini Venkataraman,King Jien Chui,Srinivasa Rao Vempati,Navab Singh
Extended Abstracts of the 2023 International Conference on Solid State Devices and Materials (2023)
Cited1Views0Bibtex
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Design and Analysis of 3D Heterogeneous Chiplet Stack for RF Front-End Module Minituarization
Mihai Dragos Rotaru, Shashank Tiwari, Paul Castillon, Chai Tai Chong,Chui King Jien
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1486-1492, (2023)
Cited1Views0EIWOSBibtex
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Demonstration and Challenges of Through Si Interposer (TSI) with 5-Layer Frontside Cu Metal and 2-Layer Backside Cu RDL
Ya-Ching Tseng,King-Jien Chui
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.1067-1070, (2023)
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Demonstration of a CMOS-Compatible Superconducting Cryogenic Interposer for Advanced Quantum Processors
King-Jien Chui, Hongyu Li,Yong Chyn Ng,Chit Siong Lau,K. E. J. Goh,D. Huang,Ya-Ching Tseng, J. K. Chen, H. Yu, B. N. Jaafar, H. Lin, B. Varghese
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.617-622, (2023)
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Room Temperature Plasma-Enhanced Niobium-Niobium Wafer Bonding for 3D Integration of Superconducting Interconnects for Quantum Processing
Simon Chun Kiat Goh,Cheemalamarri Hemanth Kumar,Liangxing Hu, Woon Shervonne,Norhanani Jaafar, Yap Lee Khoon Sherry,Ding Huang,Chit Siong Lau, Senthil Kumar Karuppannan, Hongyu Li,Chuan Seng Tan,King-Jien Chui
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.404-408, (2023)
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Author Statistics

#Papers: 90

#Citation: 1149

H-Index: 20

G-Index: 32

Sociability: 6

Diversity: 2

Activity: 2

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