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Papers共 131 篇Author StatisticsCo-AuthorSimilar Experts

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Reliable Chiplet Integration on High Density Laminate (2.XD) for AI Hardware
Divya Taneja, Jonathan Grenier, Joseph Ross, Horiyuki Mori, Sathya Raghvan, Brian Quinlan,Isabel De Sousa,Thomas Wassick,Griselda Bonilla
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.581-586, (2024)
Cited0Views0EIWOSBibtex
0
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New Roadmap for Microelectronics: Charting the Semiconductor Industry's Path over the Next 5, 10, and 20 Years
Gamal Refai-Ahmed, Victor V. Zhirnov, SB Park,Amr S Helmy,Bahgat Sammakia,Kanad Ghose, James A. Ang,Griselda Bonilla, Tayseer Mahdi,Jim Wieser,Suresh Ramalingam
2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)pp.1260-1266, (2024)
Cited0Views0EIWOSBibtex
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On the Path to AI Hardware Via Chiplet Integration Enabled by High Density Organic Substrates
Griselda Bonilla, Brian Quinlan,Thomas Wassick, Russell Kastberg,Shidong Li, Monali Basutkar
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1374-1380, (2023)
Cited1Views0EIWOSBibtex
1
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Heterogeneous Integration on Organic Interposer Substrate with Fine-Pitch RDL and 40 Micron Pitch Micro-bumps
Katsuyuki Sakuma,Griselda Bonilla,Dale McHerron,Toyohiro Aoki, Russell Kastberg,Glenn Pomerantz, Jay Bunt,Tom Wassick
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.872-877, (2023)
Cited5Views0EIWOSBibtex
5
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Artificial Intelligence (AI) Based Methodology to Minimize Asymmetric Bare Substrate Warpage
Sathya Raghavan,Hiroyuki Mori,Griselda Bonilla,Katsuyuki Sakuma
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1213-1218, (2023)
Cited0Views0EIWOSBibtex
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Author Statistics

#Papers: 131

#Citation: 3913

H-Index: 26

G-Index: 56

Sociability: 6

Diversity: 2

Activity: 0

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