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论文共 9 篇作者统计合作学者相似作者

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A 7nm Cmos Technology Platform For Mobile And High Performance Compute Application
S. Narasimha,B. Jagannathan,A. Ogino,D. Jaeger,Brian J. Greene,C. Sheraw,K. Zhao, B. S. Haran,Unoh Kwon, A. K. M. Mahalingam,B. Kannan, B. Morganfeld,J. Dechene,C. Radens, A. Tessier,A. Hassan, H. Narisetty,I. Ahsan,M. Aminpur, C. An,M. Aquilino,A. Arya,Rod Augur, N. Baliga, R. Bhelkar,G. Biery,A. Blauberg, N. Borjemscaia,A. Bryant,L. Cao, V. Chauhan, M. Chen, L. Cheng, J. Choo,C. Christiansen,Tao Chu,B. Cohen, R. Coleman,D. Conklin, S. Crown, A. da Silva,D. Dechene, G. Derderian, S. Deshpande, G. Dilliway, K. Donegan,Manfred Eller, Y. Fan,Q. Fang, A. Gassaria,R. Gauthier,S. Ghosh, G. Gifford,T. Gordon,M. Gribelyuk, G. Han, J.H. Han, K. Han, M. Hasan,J. Higman,J. Holt, L. Hu, L. Huang,C. Huang,T. Hung,Y. Jin,J. Johnson, S. Johnson,V. Joshi,M. Joshi,P. Justison, S. Kalaga,T. Kim, W. Kim,R. Krishnan,B. Krishnan,K. Anil,M. Kumar, J. Lee,R. Lee,J. Lemon,S.L. Liew, P. Lindo,M. Lingalugari, M. Lipinski, P. Liu, Jinping Liu, S. Lucarini,W. Ma,E. Maciejewski, S. Madisetti, A. Malinowski,J. Mehta, C. Meng,S. Mitra, C. Montgomery,H. Nayfeh,T. Nigam,G. Northrop,K. Onishi, C. Ordonio,M. Ozbek,Rohit Pal,Sanjay Parihar,O. Patterson,E. Ramanathan,I. Ramirez,R. Ranjan, J. Sarad,V. Sardesai, S. Saudari, C. Schiller,Biswanath Senapati, C. Serrau, N. Shah,T. Shen,H. Sheng,J. Shepard, Y. Shi,M.C. Silvestre,D. Singh, Z. Song, J. Sporre,P. Srinivasan, Z. Sun,A. Sutton,R. Sweeney,K. Tabakman, M. Tan, X. Wang,E. Woodard, G. Xu, D. Xu, T. Xuan,Y. Yan, J. Yang,K.B. Yeap, M. Yu,A. Zainuddin, J. Zeng, K. Zhang, M. Zhao, Y. Zhong,Rick Carter,Chung-hsun Lin,Stephan Grunow,C. Child, M. Lagus,Robert Fox,E. Kaste, G. Gomba,Srikanth Samavedam,P. Agnello,D. K. Sohn
2017 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)（2017）
引用55浏览0EIWOS引用
55
0
Cu/SiLK integration: Influence of process on reliability
V McGahay, C Adams,E Barth,G Biery, Z Chen, X Chen,S Das,C Davis, B Engel,J Fitzsimmons,J Gill,J Gambino, R Geffken,R Goldblatt, L Hadel,B Kastenmeier, W Klaasen,W Landers,S Luce,N Lustig, J Marino, A Martin,T McDevitt, J McGrath,I Melville,D Nguyen, R Procter,H Rathore,SC Seo,T Spooner,A Stamper,T Standaert, C Tian,J Wynne
MATERIALS RESEARCH SOCIETY CONFERENCE PROCEEDINGSpp.3-9, (2001)
引用1浏览0引用
1
0
A High Performance 0.13 /spl Mu/m SOI CMOS Technology with a 70 Nm Silicon Film and with a Second Generation Low-K Cu BEOL
J. Sleight,P. Varekamp,N. Lustig,J. Adkisson, A. Allen,O. Bula, X. Chen, T. Chou, W. Chu, J. Fitzsimmons,A. Gabor, S. Gates, P. Jamison,M. Khare, L. Lai, J. Lee,S. Narasimha, J. Ellis-Monaghan, K. Peterson,S. Rauch, S. Shukla,P. Smeys, T. Su, J. Quinlan,A. Vayshenker, B. Ward, S. Womack,E. Barth,G. Biery, C. Davis,R. Ferguson,R. Goldblatt,E. Leobandung, J. Weiser,I. Yang,P. Agnello
semanticscholar
引用7浏览0EIWOS引用
7
0
A 0.18 /spl Mu/m High-Performance Logic Technology
S. Crowder, S. Greco, H. Ng,E. Barth, K. Beyer,G. Biery, J. Connolly,C. Dewan,R. Ferguson, X. Chen,M. Hargrove, E. Nowak, P. McLaughlin, R. Purtell, R. Logan,J. Oberschmidt, A. Ray,D. Ryan,K. Tallman, T. Wagner,V. McGahay,E. Crabbé,P. Agnello,R. Goldblatt, L. Su,B. Davari
semanticscholar
引用0浏览0引用
0
0
作者统计

#Papers: 9

#Citation: 257

H-Index: 6

G-Index: 8

Sociability: 6

Diversity: 1

Activity: 0

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