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Papers共 51 篇Author StatisticsCo-AuthorSimilar Experts

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A Stretchable Frequency Reconfigurable Antenna Controlled by Compressive Buckling for W-band Applications
Qi Wang,Zetian Wang, Yang,Chi Zhang,Mengdi Han,Wei Wang, Yufeng Jin
Microsystems & nanoengineeringno. 1 (2025): 86-86
Cited0Views0WOSBibtex
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High-density Embedded Silicon Fan-out (H-Esifo) Process for a CMOS Operational Amplifier
Lang Chen, Bohan Zhang,Chi Zhang,Wei Wang
2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT (2024)
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Numerical Optimization of PCM-Based Heat Sink for Thermal Management of High-power-density Electronics
Ran Hu,Jianyu Du, Shangyang Shi, Huiquan Cao,Chi Zhang,Wei Wang,Yufeng Jin
2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)pp.1176-1181, (2024)
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Polymer-Based Wafer-Level Warpage Prediction and Regulation for the Advanced Packaging
Lang Chen,Peijue Lyu, Qi Wang,Yufeng Jin,Chi Zhang,Wei Wang
2024 IEEE 19TH INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS, NEMS 2024 (2024)
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Embedded Cooling Method with Monolithic Dual-Layer Microchannel Cold Plate for High-Power Chips
Jianyu Du,Hongxu Wu,Huaiqiang Yu,Chi Zhang,Wei Wang
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.1619-1622, (2024)
Cited1Views0EIWOSBibtex
1
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Numerical Study on Hybrid Discontinuous Microchannel Heat Sink Combining Manifold with Pin Fins (DMC-MPF) for High Power Electronic Device
Jianyu Du,Lang Chen, Ran Hu,Huaiqiang Yu,Chi Zhang,Wei Wang
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.2096-2100, (2024)
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Optimization of Embedded Cooling for Hotspots Based on Compound Plate Thermal Spreading Model
Jianyu Du,Yuchi Yang,Huaiqiang Yu, Xin Yu,Wei Wang,Chi Zhang
International Journal of Heat and Mass Transfer (2024): 125866-125866
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Author Statistics

#Papers: 51

#Citation: 2035

H-Index: 20

G-Index: 30

Sociability: 5

Diversity: 3

Activity: 38

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