Che Lin (Senior Member, IEEE) received the B.S. degree in electrical engineering from the National Taiwan University in 1999, and the M.S. degree in electrical and computer engineering, the M.S. degree in mathematics, and the Ph.D. degree in electrical and computer engineering from the University of Illinois at Urbana–Champaign in 2003 and 2008, respectively. He was with the Department of Electrical Engineering, National Tsing Hua University, from 2008 to 2019. He is currently a Tenured Full Professor with the Department of Electrical Engineering, National Taiwan University, leading the interdisciplinary Data Science and Signal Processing (iDSSP) Laboratory. His research interests include deep learning, data science, medical AI, FinTech, signal processing in wireless communications, optimization theory, and systems biology. Dr. Lin received the two-year Vodafone Graduate Fellowship in 2006, the E. A. Reid Fellowship Award in 2008, and holds a U.S. patent, which has been included in the 3GPP LTE standard. In 2012, he received the Excellent Teaching Award for the College of EECS, NTHU. He was awarded the Best Paper Award for the 2014 GIW-ISCB-ASIA Conference. In 2015, he received the CIEE Outstanding Young Electrical Engineer Award. In 2017, he received the Young Scholar Innovation Award from the Foundation for the Advancement of Outstanding Scholarship. He has been actively involved in organizing and chairing sessions and has served as a technical program committee member for several international conferences. He was an Elected Member of Design and Implementation of Signal Processing Systems Technical Committee (DISPS TC), IEEE Signal Processing Society, from 2019 to 2020. He has been serving as the Chair for the Industry Subcommittee and an Elected Member of machine learning for Signal Processing Technical Committee (MLSP TC), IEEE Signal Processing Society, since 2021. He has also been an Elected Member of the Applied Signal Processing Systems Technical Committee (ASPS TC), IEEE Signal Processing Society, since 2021.