David Bourrier - LAAS-CNRS | 人才画像

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Bio

David Bourrier is an Assistant Engineer with LAAS-CNRS, a Lab of the National Research Center. He works on the TEAM in charge of the Electroplating area, the wet etching of silicon area, and the support development on MEMS research. He works on the development of new photoresists and on electroplating optimization. He has authored two papers, co-authored over 58 papers, and holds one patent. His current research interests include molds realization and electroplating.

Research Interests

Papers共 102 篇Author StatisticsCo-AuthorSimilar Experts

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Bose-Einstein-condensate Source on an Optical-Grating-based Atom Chip for Quantum Sensor Applications

R. Calviac,A. Rouxel, S. Charlot,D. Bourrier,A. Arnoult,A. Monmayrant,O. Gauthier-Lafaye,A. Gauguet, B. Allard

PHYSICAL REVIEW APPLIEDno. 1 (2025)

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Process for Integrating Multiple Porous Silicon Membranes with Variable Characteristics into Planar Microfluidics

Douglas Silva de Vasconcellos,David Bourrier,Eric Imbernon,Kata Hajdu,Yingning He,Thierry Leichle

SENSORS AND ACTUATORS A-PHYSICAL (2024)

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Shadow-mask Evaporation for the Fabrication of Optical Filters with Spatially Tailored Thickness

Stéphane Calvez, Justine Bonneau,David Bourrier,Ludovic Salvagnac,Pascal Dubreuil,Isabelle Séguy,Henri Camon

Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XVII (2024)

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Parallel On-Chip Micropipettes Enabling Quantitative Multiplexed Characterization of Vesicle Mechanics and Cell Aggregates Rheology

Sylvain Landiech,Marianne Elias, Pierre Lapeze, Hajar Ajiyel, Marine Plancke,Blanca Gonzalez-Bermudez,Adrian Laborde,Fabien Mesnilgrente,David Bourrier,Debora Berti,Costanza Montis,Laurent Mazenq, Jeremy Baldo,Clement Roux,Morgan Delarue,Pierre Joseph

APL Bioengineeringno. 2 (2024)

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Concept and Technology for Full Monolithic MOSFET and JBS Vertical Integration in Multi-Terminal 4H-Sic Power Converters

Ralph Makhoul,Nour Beydoun,Abdelhakim Bourennane,Luong Viet Phung,Frédéric Richardeau,Mihai Lazar,Philippe Godignon,Dominique Planson,Hervé Morel,David Bourrier

Solid State Phenomena (2024): 23-30

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Full-SiC Single-Chip High-Side and Low-Side Dual-MOSFET for Ultimate Power Vertical Integration – Basic Concept and Technology

Ralph Makhoul,Nour Beydoun,Abdelhakim Bourennane,Luong Viet Phung,Mihai Lazar,Frederic Richardeau,Philippe Godignon,Dominique Planson,Herve Morel,David Bourrier

2023 25TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS, EPE'23 ECCE EUROPE (2023)

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Monolithic Integration of Thick NDFeB Micro-Magnets into Mems: Application to Electromagnetic Energy Harvesting

Elías Angulo-Cervera, Frederico Orlandini-Keller,Ilona Lecerf,Pierre Moritz,Fabrice Mathieu,David Bourrier,Samuel Charlot,Richard Haettel,Thibaut Devillers,Liviu Nicu,Thomas Blon,Lise-Marie Lacroix,Nora M. Dempsey,Thierry Leïchlé

2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)（2023）

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A Simple Process for the Fabrication of Parallel-Plate Electrostatic MEMS Resonators by Gold Thermocompression Bonding

Dolores Manrique Juarez,Fabrice Mathieu,Guillaume Libaude,David Bourrier,Samuel Charlot,Laurent Mazenq,Veronique Conedera,Ludovic Salvagnac,Isabelle Dufour,Liviu Nicu,Thierry Leichle

2023 IEEE 36TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, MEMSpp.643-646, (2023)

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Clean Room Engineers' Exchanges: a Win/win International Collaboration

David Bourrier,Ayako Mizushima,Norio Shimamoto,Etsuko Ota,Hugues Granier,Yoshio Mita

openalex（2023）

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