Alex Paterson

Alex Paterson received the B.Sc. and Dr. Phil. degrees in physics from the University of Strathclyde, Glasgow, U.K., in 1994 and 1998, respectively. In 1998, he moved to Santa Clara, CA, to join the Etch Division, Applied Materials, Inc., where he became a Member of the RF Plasma Technology Team. He was involved in developing and productizing novel plasma technologies for 200- and 300-mm wafer processing of next-generation IC feature sizes, ranging from 0.25 $\mu\hbox{m}$ to sub-45 nm, for conductor and dielectric etch applications. In 2007, he moved to LAM Research Corporation, where he is currently a Technical Director and manages a group of scientists responsible for concept and feasibility studies of enabling plasma technologies for the Conductor Etch Division. He has over ten publications in the low-temperature plasma field, and has given invited talks on RF plasma processing technologies, and is the holder of over 15 patents either granted or pending. Dr. Paterson is a member of the Institute of Physics, a Chartered Physicist, and was a member of the Department of Energy's study for identifying the challenges facing low-temperature plasmas over the next ten years.